发明名称 Packaging method of temperature insensitive arrayed waveguide grating
摘要 The temperature dependency of center wavelength of AWG is compensated by adjusting optical input position by cutting interface between input slab waveguide of AWG and stripe waveguide circuit connected to input slab, followed by attaching lateral sliding rod which has larger Coefficient of Thermal Expansion than chip substrate. These cut-elements are passively re-aligned on the top surface of the alignment base substrate. The cut-element of AWG main body is adhered on alignment base substrate, and the cut-element of the strip waveguide circuit connected to the input slab is attached to the lateral sliding rod. The gap between the facets of re-aligned two cut-elements is maintained by inserting thin film followed by filling gap-fill material with no flowing nature to minimize degradation of optical characteristics and maintain free lateral movement between these two cut-elements.
申请公布号 US7912330(B2) 申请公布日期 2011.03.22
申请号 US20050794767 申请日期 2005.06.30
申请人 POINTEK INCORPORATION 发明人 RHEE TAE HYUNG;LEE HYUNG JAE;KIM TAE HUN
分类号 G02B6/12;G02B6/34 主分类号 G02B6/12
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