发明名称 |
Bumpless wafer scale device and board assembly |
摘要 |
A semiconductor chip having a planar active surface including an integrated circuit; the circuit has metallization patterns including a plurality of contact pads. Each of these contact pads has an added conductive layer on the circuit metallization. This added layer has a conformal surface adjacent the chip and a planar outer surface, and this outer surface is suitable to form metallurgical bonds without melting. The chip contact pads may have a distribution such that an area portion of the active chip surface is available for attaching a thermally conductive plate; this plate has a thickness compatible with the thickness of the conductive pad layer. |
申请公布号 |
US7910471(B2) |
申请公布日期 |
2011.03.22 |
申请号 |
US20040769699 |
申请日期 |
2004.02.02 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
ZUNIGA-ORTIZ EDGAR R.;KODURI SREENIVASAN K. |
分类号 |
H01L21/44;H01L23/485 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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