| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board where a conductive layer positioned in the lower layer of a recognition mark formed by laser processing is not exposed from the recognition mark and also where a contrast between the recognition mark formed by laser processing and the circumference of the mark is made to be superior thereby to read the recognition mark without erroneous reading. SOLUTION: The wiring board includes an insulating base 2 formed by laminating a plurality of insulating layers 1, the conductive layers 3 arranged on the inner side and surface of the insulating base 2, and a solder resist layer 4 coated on the surface of the insulating base 2, in which the recognition mark 5 is formed by performing laser processing on the surface of the solder resist layer 4 or the insulating base 2. The conductive layer 3 in size capable of containing the recognition mark is formed between the insulating layers 1 in an area corresponding to the recognition mark 5 without the intervention of another conductive layer 3 with the recognition mark 5. COPYRIGHT: (C)2011,JPO&INPIT |
