| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To shorten wirings and to reduce in thickness a laminated semiconductor chip with a simple structure. <P>SOLUTION: In a semiconductor device 10, a first semiconductor chip 12 and a second semiconductor chip 13 are laminated. The first semiconductor chip 12 is formed in a quadrangle plate shape. The second semiconductor chip 13 is formed in a quadrangle plate shape and has conductive bumps 17 arranged in a region where four sides project outside compared to the first semiconductor chip 12 at prescribed intervals. In the first semiconductor chip 12, conductive bumps 14 with shorter wiring distance are arranged in vertical and lateral directions at prescribed intervals and are flip chip-bonded to an electrode of the substrate 11. The second semiconductor chip 13 is flip chip-bonded to the electrode of the substrate 11 by the conductive bumps 17 with longer wiring distance at an outer side of the first semiconductor chip 12. The respective conductive chips 14 and 17 are deposited by electrolytic plating and are formed in almost columnar shapes. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
