| 摘要 |
1,246,668. Semi-conductor devices. TOKYO SHIBAURA ELECTRIC CO. Ltd. 6 Sept., 1968 [6 Sept., 1967; 27 Sept., 1967; 14 Feb., 1968], No. 13602/71. Divided out of 1,246,667. Heading H1K. The disclosure of the present Specification is entirely contained in Specification 1,246,667 but the claims relate to an assembly of semiconductor elements situated between an electrode plate and a parallel further plate which is either conductive or is insulating and carries a conductor strip thereon, the electrodes of the elements being connected to the plates or to the conductor strip thereon, and the plates being at least partially held together by an organic, insulating adhesive which laterally surrounds and seals the semi-conductor elements. |
