SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor device includes a semiconductor chip having a connection electrode on a surface side, and a resin substrate sealing a periphery of the semiconductor chip and formed to have a thickness from a back surface of the semiconductor chip to a lower side thereof, and the resin substrate whose lower surface is positioned to a lower side than the back surface of the semiconductor chip. A wiring layer is connected directly to the connection electrode of the semiconductor chip without the intervention of solder.