| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a molded electronic component improved in the mold-releasing property of a molded part while improving the visibility of a label mark. <P>SOLUTION: The molded part of the electronic component is formed by sealing a semiconductor chip with mold resin, and the component has a label mark region formed by forming the label mark on the surface of the molded part by a laser. The surface roughness of the molded part except the label mark region is made larger than that of the molded part in the label mark region. Especially, the surface roughness of the molded part in the label mark region is specified so as to be less than 3μm while the surface roughness of the molded part except the label mark region is specified so as to be more than 10μm. Further, a low surface roughness region whose surface roughness is the same as that of the molded part in the label mark region is formed so as to be continued to the label mark region, and this low surface roughness region is formed so as to have a projected shape with respect to the label mark region. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
