LIGHTING EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to increase light efficiency by improving an orientation angle through a curved type cavity. CONSTITUTION: A curved type cavity(120) is formed on the upper side of a package body(110) of a silicon wafer. A cavity(120) is formed by etching the package body of the silicon wafer. A light emitting diode includes a first light emitting diode(101A) and a second light emitting diode(101B). A package structure includes a first cavity and a second cavity for mounting a first light emitting diode and a second light emitting diode respectively. The first cavity and the second cavity include a metal wire for electrically connecting the first and second light emitting diodes.