FABRICATING METHOD OF PRINTED CIRCUIT BOARD

摘要

PURPOSE: A fabricating method of a printed circuit board is provided to make a small via hole by forming an electrolysis copper plating layer on an electroless copper plating layer. CONSTITUTION: In a fabricating method of a printed circuit board, a copper laminated plate is prepared in both sides of an insulating layer(12). A first via hole is formed from the copper laminated plate to the center. A second via hole is formed from the bottom of the copper laminated plate to the center. The second via hole is partly connected to the first via hole in the center of the insulating layer. The electroless copper plating layer is formed on the interior of the first and second via holes and the top of a copper foil. An electrolysis copper plating layer is formed on the electroless copper plating layer.