Method for manufacturing a printed circuit board having a landless via,申请号KR20080114688-传众专利搜索

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发明名称	Method for manufacturing a printed circuit board having a landless via
摘要
申请公布号	KR101022887(B1)	申请公布日期	2011.03.16
申请号	KR20080114688	申请日期	2008.11.18
申请人		发明人
分类号	H05K3/40;H05K3/42	主分类号	H05K3/40
代理机构		代理人
主权项
地址

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