| 摘要 |
The device has electronic components (120, 130) e.g. passive component, distributed on levels (N2, N3) that are connected from a level (N1) housing an electronic component (110). An electrolytic contact pad (10.1) i.e. micro insert, directly connects conductor elements (C1, C2) on a surface of the component (120) to a conductor element on an opposite surface of the level (N1). An electrolytic contact pad (20.1) i.e. fusible ball, crosses both sides of a covering layer that covers the component (110). The pad (20.1) directly connects conductor elements located on both sides of the layer. An independent claim is also included for a method for forming a stacked electronic device. |
