| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid resin coating device, along with a laser processing device provided with a liquid resin coating function, capable of effectively using a liquid resin coated on the surface of a wafer. SOLUTION: The liquid resin coating device coats the liquid resin on the surface of a wafer. It comprises a liquid resin pool which holds the liquid resin, and a wafer submerging means which holds the backside of the wafer and submerges the surface of the wafer to the surface of the liquid resin held in the liquid resin pool so that a resin film is coated on the surface of the wafer. COPYRIGHT: (C)2007,JPO&INPIT |
