An integrated circuit comprises a lead frame portion having a plurality of leads; a first current conductor portion comprising at least two of the plurality of leads; a substrate having first and second opposing surfaces, the first surface proximate to said first current conductor portion and the second surface distal from said first current conductor portion; one or more magnetic field transducers disposed on the first surface of said substrate; and a second current conductor portion deposited on the first surface of the substrate, disposed proximate to the one or more magnetic field transducers, and coupled to the first current conductor portion.
申请公布号
EP2295993(A1)
申请公布日期
2011.03.16
申请号
EP20100183958
申请日期
2006.05.23
申请人
ALLEGRO MICROSYSTEMS INC.
发明人
DOOGUE, MICHAEL, C;SHARMA, NIRMAL;GAGNON, JAY;DICKINSON, RICHARD