A FABRICATING METHOD OF A PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for manufacturing a printed circuit board is provided to process a via and form the second solder resist layer on a dual processing substrate, thereby minimizing damages of a printed circuit board. CONSTITUTION: The first carrier part with the first pattern part is formed on one side of a printed circuit board. The first solder resist layer(230) and the second carrier part are manufactured on the printed circuit board. The first and second pattern units are impregnated on an insulating layer. Two base substrates are attached each other to face the first solder resist layer. A via and the second solder resist layer are formed on the insulating layer to remove an adhesive layer.