| 摘要 |
PURPOSE: A via hole copper filled PCB and a method thereof are provided to transfer heat from a circuit pattern layer to outside by forming a copper coating layer over a via hole. CONSTITUTION: In a via hole copper filled PCB and a method thereof, base copper foil layers(14,14') are formed on the top and bottom of a substrate base(12). A via hole(16) is formed in the substrate base and the base copper foil layer. A hole copper coating(18) is formed in the top and bottom of the base copper foil layer and the inside of the via hole. A via hole copper filled coating layer(24) is formed on the inside of a groove through a hole copper coating layer inside the via hole. Copper coating layer(26,26') is formed the outside of the top and bottom of the hole copper coating layer and also is formed on the outside of top and bottom of the via hole copper filled coating layer.
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