| 摘要 |
PURPOSE: A fabricating method of a flexible printed circuit board is provided to form the thickness of a plating layer very thin and uniform by forming a second metal layer and a conductive layer while blocking a via hole with an insulating layer. CONSTITUTION: In a fabricating method of a flexible printed circuit board, a first metal layer is formed on the single-side of an insulating film(S1). A via hole passing through the first metal layer is formed in the insulating film(S2). The insulating layer is formed on the one side of the first metal layer to cover a via hole which is formed on the first metal layer(S3). A second metal layer is formed by performing a sputtering deposition process on the via hole and the insulating film(S4). A plating layer is formed by plating the second metal layer(S5). The insulating layer is removed(S6).
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