| 摘要 |
PURPOSE: An organic photo-resist removing composition is provided to effectively separate a cured photo-resist after an ion-implantation process for forming a source/drain region. CONSTITUTION: An organic photo-resist removing composition includes the following: 1 to 70 weigh% of one or more compounds selected from a group including a compound represented by chemical formula 1 and quaternary ammonium hydroxide is prepared. 10 to 40 weigh% of a compound represented by chemical formula 2 is prepared. 1 to 40 weigh% of one or more compounds selected from a group including saccharides, sugar alcohols, C3-C10 hydroxyl cycloalkane compounds, aromatic hydroxyl compounds, acetylene alcohols, carboxylic acid compounds, anhydrides of the carboxylic acid compounds, and triazol compounds is prepared. 5 to 30 weight% of one or more organic solvents selected from a group including alkylene glycol-based compounds is prepared. |
