发明名称 PATTERNING PROCESS AND CHEMICAL AMPLIFIED PHOTORESIST WITH A PHOTODEGRADABLE BASE
摘要 A method for fabricating an integrated circuit device is disclosed. The method includes providing a substrate; forming a first material layer over the substrate; forming a second material layer over the first material layer, wherein the second material layer comprises a photodegradable base material; and exposing at least a portion of the second material layer.
申请公布号 US2011059396(A1) 申请公布日期 2011.03.10
申请号 US20090555145 申请日期 2009.09.08
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 WANG CHIEN-WEI;CHANG CHING-YU;GAU TSAI-SHENG;LIN BURN JENG
分类号 G03F7/20;G03F7/004 主分类号 G03F7/20
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