| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a co-packaged device having two or more devices while decreasing the number of components needed for an assembly. <P>SOLUTION: The co-packaged semiconductor device 10 including an outer clip 12 in the form of a metal can include also two semiconductor dies 30, at least one of which uses the outer clip as an electrical connector. An inner clip 28 is used to dispose one of the dies within the outer clip. The inner clip may be insulated from the outer clip by an insulating layer. <P>COPYRIGHT: (C)2011,JPO&INPIT |
