发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board allowing a large current to be carried by connecting the front side to the back side of the printed wiring board by a simple structure. SOLUTION: This printed wiring board 10 is composed by laminating a first surface-side circuit pattern board 20, a core resin layer 30 and a second surface-side circuit pattern board 40. A projecting part 22 and a tubular part 42 formed by pressing the first surface-side circuit pattern board 20 and the second surface-side circuit pattern 40 each being large in thickness, respectively, allow a large current to be carried. The projecting part 22 and the tubular part 42 can be inexpensively formed by pressing work. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011049520(A) 申请公布日期 2011.03.10
申请号 JP20100053357 申请日期 2010.03.10
申请人 TIBC:KK 发明人 SHIMATSU HITOSHI;KONDO KAZUNORI;SAWADA TAKEHIKO;ASAI TOMORO;HAYAKAWA TAKAHIRO
分类号 H05K1/11;H05K3/40 主分类号 H05K1/11
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