| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of securing high reliability even at a high temperature by lowering a heat stress generated in a connection part at the change of temperature as much as possible in a structure where two kinds of materials, such as a semiconductor element and an electrode, are connected on surfaces. <P>SOLUTION: The semiconductor device includes: a semiconductor element; a first stress adjuster, which is connected with the semiconductor element via a connection member and on which holes are formed; a second stress adjuster where protrusions to be pressed into the holes are provided; and a heat conductive material filled in between the first stress adjuster and the second stress adjuster. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
