| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electric component capable of improving the reliability of a connection wire connecting between two elements as compared with a conventional method as to an electric component formed by laminating a circuit element and a function element on the same substrate through an insulating film. <P>SOLUTION: The electric component includes a first wire 22A connected to a CMOS transistor 11 and formed on a first insulating film 20, a second wire 31 formed through a second insulating film 30 formed on the first wire 22A and connected to a MEMS element 50, third and fourth insulating films 40, 60 covering the surface of the second wire 31, and a connection wire 70 connecting the second wire 31 to the first wire 22A. In the connection wire 70, a first via 71 piercing the fourth and third insulating films 60, 40 in a formation position of the second wire 31, a second via 702 piercing the fourth to second insulating films 60, 40, 20 in a formation position of the first wire 22A and a connection wire 703 connecting the first and second vias 701, 702 on the fourth insulating film 60 are integrally formed by the same material. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
