发明名称 EXPOSURE DEVICE, EXPOSURE METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To correct a transfer pattern during exposure in a simple method with sufficient precision. <P>SOLUTION: An exposure device includes a specific transfer pattern determination unit 22 which determines, for two or more unit patterns, a specific transfer pattern as a transfer pattern in a predetermined place of a unit pattern among transfer patterns projected through a photomask including a plurality of unit patterns in the same shape arranged at predetermined intervals in an internal pattern. The exposure device includes an error arithmetic unit 23 which computes an error between a transfer pattern projected through the photomask and a predetermined transfer pattern through comparison between a relative position between specific transfer patterns and a prescribed value of the relative position. The exposure device includes a correction parameter arithmetic unit 24 which computes a correction parameter for correcting a transfer pattern based upon the computed error, and a correction control unit (exposure control unit 27) which corrects a condition of exposure using the correction parameter so that the transfer pattern is corrected. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011049232(A) 申请公布日期 2011.03.10
申请号 JP20090194449 申请日期 2009.08.25
申请人 RENESAS ELECTRONICS CORP 发明人 TSUBATA KYOICHI
分类号 H01L21/027;G03F7/20 主分类号 H01L21/027
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