发明名称 MANUFACTURING METHOD OF CERAMIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic substrate in which there is no plating adhesion and cracks of substrate, and there is no residue of a resist component. SOLUTION: The manufacturing method of ceramic substrate includes a process of preparing the ceramic substrate, and a surface electrode 21 and a foundation electrode 22 formed on one main surface of the ceramic substrate, and further includes a process to prepare the ceramic substrate, the surface electrode 21, and the foundation electrode 22 so that the thickness from another main surface of the ceramic substrate of the surface electrode 21 becomes larger than the thickness from another main surface of the ceramic substrate of the foundation electrode 22. The method includes a process of forming a plated electrode 31 on the surface electrode 21 and on the foundation electrode 22, and a process of removing the plated electrode on the surface electrode 21. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011049292(A) 申请公布日期 2011.03.10
申请号 JP20090195504 申请日期 2009.08.26
申请人 MURATA MFG CO LTD 发明人 MORI TOMOHIKO
分类号 H05K3/26;H05K3/24 主分类号 H05K3/26
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