| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of detaching electronic components in which a plurality of electronic components can be detached from a printed board while suppressing the number of times of a thermal history of the printed board, and to provide an electronic apparatus. SOLUTION: The method of detaching the electronic components includes heating a solder bump 26 joining the plurality of electronic components 20a and 20b mounted on a first surface of the printed board 10 to the printed board 10; and separating a coupling plate 40 coupling the plurality of electronic components 20a and 20b to each other from the printed board 10 to detach the plurality of electronic components 20a and 20b from the printed board 10 at the same time. COPYRIGHT: (C)2011,JPO&INPIT
|
