| 摘要 |
PROBLEM TO BE SOLVED: To obtain a capacitive sensor that improves accuracy of machining of bonding thickness and bonding width of an intermediate layer, by improving the machining accuracy of a recess for containing the intermediate layer. SOLUTION: A glass substrate 2 and a silicon substrate 3 are bonded indirectly with a connection member 5 interposed between the surfaces 2a and 3a facing each other. A recess 6 for containing the connection member 5 is formed in the silicon substrate 3. The recess 6 is formed beforehand along the bonding thickness T and the bonding width W of the connection member 5, and the connection member 5 is pressurized or heated and contained in the recess 6 when the glass substrate 2 and the silicon substrate 3 are bonded. The recess 6 is formed in the silicon substrate 3 having a hardness lower than that of the glass substrate 2, thereby improving the accuracy of machining the recess 6. COPYRIGHT: (C)2011,JPO&INPIT
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