| 摘要 |
PURPOSE: A mold for manufacturing a semiconductor package and a method for manufacturing a semiconductor package using the same are provided to improve productivity by integrating a protrusion for forming a hole with the mold for molding a lower package and forming a stack hole in the molding resin at the same time. CONSTITUTION: An upper package(100) using a first substrate(102) and a lower package(200) using a second substrate(202) are vertically stacked. The upper package is closely adhered to a ball land for stack formed in an upper side of a second substrate of a lower package by integrating a protrusion(14) for forming a hole with a preset length in the bottom of a shape(12) of a mold(10). |
