Method of and apparatus for removing a metal oxide from a treating surface of a substrate ; Method of reducing metal oxides and forming a solder joint in a substrate

摘要

Described herein are a method and an apparatus for removing metal oxides and/or forming solder joints on at least a portion of a substrate surface (300) within a target area. In one particular embodiment, the method and apparatus to reduce metal oxides and form a solder joint within a substrate comprising a layer having a plurality of solder bumps by providing one or more energizing electrodes (302) and exposing at least a portion of the layer and solder bumps to the energizing electrode (302).