摘要 |
PURPOSE: A heat radiation board and a manufacturing method thereof are provided to rapidly discharge heat by using a heat transmission path and a filler. CONSTITUTION: A heating element(20) is mounted on a conductive layer(13). A heat sink(11) emits heat. The heat is generated by the heating element. An insulation layer(12) is prepared between the conductive layer and the heat sink. A heat transmission path(14) passes through the conductive layer and the insulation layer. The heat is transmitted to the heat sink through the heat transmission path. A filler(15) is filled in the heat transmission path.
|