发明名称 HEAT DISSIPATING CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 PURPOSE: A heat radiation board and a manufacturing method thereof are provided to rapidly discharge heat by using a heat transmission path and a filler. CONSTITUTION: A heating element(20) is mounted on a conductive layer(13). A heat sink(11) emits heat. The heat is generated by the heating element. An insulation layer(12) is prepared between the conductive layer and the heat sink. A heat transmission path(14) passes through the conductive layer and the insulation layer. The heat is transmitted to the heat sink through the heat transmission path. A filler(15) is filled in the heat transmission path.
申请公布号 KR20110024686(A) 申请公布日期 2011.03.09
申请号 KR20090082791 申请日期 2009.09.03
申请人 AN, BOK MAN 发明人 AN, BOK MAN
分类号 H05K1/02 主分类号 H05K1/02
代理机构 代理人
主权项
地址