发明名称 |
Electrical circuit assembly for high-power electronics |
摘要 |
An electrical circuit assembly includes an electrical circuit substrate having a first side; a heat sink including a metal base plate having a first side and a second side, and a plurality of fins extending from the second side; and a thermally conductive and electrically insulating adhesive directly interconnecting at least a portion of the first side of the electrical circuit substrate with the first side of the base plate.
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申请公布号 |
US7903417(B2) |
申请公布日期 |
2011.03.08 |
申请号 |
US20070869006 |
申请日期 |
2007.10.09 |
申请人 |
DEERE & COMPANY |
发明人 |
STAHLHUT RONNIE DEAN;GODBOLD CLEMENT VANDEN;HOPMAN JEFFREY GERALD;KARNA KARTHEEK;SPRINGER JAMES ARTHUR;ALVES JOHN LOPES |
分类号 |
H05K7/20;F28F7/00;H01L23/34 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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