发明名称 Electrical circuit assembly for high-power electronics
摘要 An electrical circuit assembly includes an electrical circuit substrate having a first side; a heat sink including a metal base plate having a first side and a second side, and a plurality of fins extending from the second side; and a thermally conductive and electrically insulating adhesive directly interconnecting at least a portion of the first side of the electrical circuit substrate with the first side of the base plate.
申请公布号 US7903417(B2) 申请公布日期 2011.03.08
申请号 US20070869006 申请日期 2007.10.09
申请人 DEERE & COMPANY 发明人 STAHLHUT RONNIE DEAN;GODBOLD CLEMENT VANDEN;HOPMAN JEFFREY GERALD;KARNA KARTHEEK;SPRINGER JAMES ARTHUR;ALVES JOHN LOPES
分类号 H05K7/20;F28F7/00;H01L23/34 主分类号 H05K7/20
代理机构 代理人
主权项
地址