| 摘要 |
PURPOSE: A solid-state imaging device of an electronic device is provided to supply desired electric potential to a substrate with a light receiving unit without minimizing the size of the light receiving unit. CONSTITUTION: A solid-state imaging device comprises: a plurality of substrates stacked via wiring layers(13,14) or insulation layers(21,22); a light sensing section which is formed in one of the substrates disposed on a light incident side and which generates a signal charge in accordance with an amount of received light; and a contact portion which is connected to a non-light incident-surface side of the substrate in which the light sensing section is formed and that supplies a desired voltage to the substrate from a wire in a wiring layer disposed on a non-light incident side of the substrate. |
