发明名称 Heat-treating apparatus and method of producing substrates
摘要 A heat-treating apparatus capable of realizing a highly precise processing maintaining a high degree of safety, and a method of producing substrates are provided. The heat-treating apparatus comprises a reaction tube for treating substrates; a manifold for supporting the reaction tube; and a heater provided surrounding the reaction tube to heat the interior of reaction tube; wherein the reaction tube and the manifold are in contact with each other as their continuous flat surfaces come in contact with each other; a cover member is provided to cover the contact portion between the reaction tube and the manifold from the outer side; and the cover member is provided with at least either a gas feed port or an exhaust port communicated with a space formed among the cover member, the reaction tube and the manifold.
申请公布号 US7901206(B2) 申请公布日期 2011.03.08
申请号 US20060887004 申请日期 2006.03.27
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 MOROHASHI AKIRA;NAKAMURA IWAO;SASAJIMA RYOTA;YAMAZAKI KEISHIN;NAKASHIMA SADAO
分类号 F27D1/18;F27D3/16 主分类号 F27D1/18
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