发明名称 |
Heat-treating apparatus and method of producing substrates |
摘要 |
A heat-treating apparatus capable of realizing a highly precise processing maintaining a high degree of safety, and a method of producing substrates are provided. The heat-treating apparatus comprises a reaction tube for treating substrates; a manifold for supporting the reaction tube; and a heater provided surrounding the reaction tube to heat the interior of reaction tube; wherein the reaction tube and the manifold are in contact with each other as their continuous flat surfaces come in contact with each other; a cover member is provided to cover the contact portion between the reaction tube and the manifold from the outer side; and the cover member is provided with at least either a gas feed port or an exhaust port communicated with a space formed among the cover member, the reaction tube and the manifold.
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申请公布号 |
US7901206(B2) |
申请公布日期 |
2011.03.08 |
申请号 |
US20060887004 |
申请日期 |
2006.03.27 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC. |
发明人 |
MOROHASHI AKIRA;NAKAMURA IWAO;SASAJIMA RYOTA;YAMAZAKI KEISHIN;NAKASHIMA SADAO |
分类号 |
F27D1/18;F27D3/16 |
主分类号 |
F27D1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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