发明名称 Graded high germanium compound films for strained semiconductor devices
摘要 Embodiments of an apparatus and methods for providing a graded high germanium compound region are generally described herein. Other embodiments may be described and claimed.
申请公布号 US7902009(B2) 申请公布日期 2011.03.08
申请号 US20080316510 申请日期 2008.12.11
申请人 INTEL CORPORATION 发明人 SIMONELLI DANIELLE;MURTHY ANAND
分类号 H01L21/00 主分类号 H01L21/00
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