| 摘要 |
PURPOSE: A method for solving soldering defects of a BGA(Ball Grid Array) part is provided to easily repair a BGA part or PCB in the event of contact or wiring failure between the BGA part and the PCB or between the BGA part and electronic elements. CONSTITUTION: A method for solving soldering defects of a BGA part comprises steps of: bonding a copper wire(15) in a drill hole(13), placing a metal mask(11) on a soldering pad(7), spreading solder cream on the metal mask to be applied to the soldering pad or an end of the copper wire, removing the metal mask from the PCB after solidification of the solder cream, placing soldering balls on one side of the copper wire and the soldering pad, soldering the soldering pad, the copper wire, and the soldering balls with the solder cream, and soldering the other end of the copper wire to a pattern or electronic element.
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