| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding method for a hard wafer, which can prevent cracks from being generated even when grinding the hard wafer to be worked thinly. SOLUTION: The grinding method for the hard wafer grinds the hard wafer by a grinder including a chuck table for holding the hard wafer with a plurality of optical devices formed on a surface, and a grinding means for grinding the hard wafer held by the chuck table, the chuck table includes a suction plate having a holding face for suction-holding the wafer, and a frame body for surrounding a portion other than the holding face of the suction plate, the chuck table is communicated with a suction source via a suction route formed in the frame body, the grinder is installed in a high pressure chamber, and the hard wafer is ground by a grinding stone (of a grinding wheel) while held at pressure higher than 1 atm. in the suction plate of the chuck table by an action of the suction source. COPYRIGHT: (C)2011,JPO&INPIT |
