发明名称 |
Semiconductor Chip with Contoured Solder Structure Opening |
摘要 |
Methods and apparatus to inhibit cracks and delaminations in a semiconductor chip solder bump are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first dielectric layer over a first conductor structure of a semiconductor chip and forming a first opening in the first dielectric layer to expose at least a portion of the conductor structure. The first opening defines an interior wall that includes plural protrusions. A solder structure is coupled to the first conductor structure such that a portion of the solder structure is positioned in the first opening.
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申请公布号 |
US2011049725(A1) |
申请公布日期 |
2011.03.03 |
申请号 |
US20090553336 |
申请日期 |
2009.09.03 |
申请人 |
TOPACIO RODEN R;MCLELLAN NEIL |
发明人 |
TOPACIO RODEN R.;MCLELLAN NEIL |
分类号 |
H01L23/48;G06F19/00;H01L21/60 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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