| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosetting resin composition capable of preventing a hygroscopic nature and improving a thermal cycle resistance without deteriorating a migration resistance when the photosetting resin composition is used for a printed wiring board or the like in a cured product. <P>SOLUTION: The photosetting resin composition contains a calboxylic acid-containing resin, a photopolymerization initiator, a blocked isocyanate compound, and a maleimide compound. <P>COPYRIGHT: (C)2011,JPO&INPIT |
