发明名称 |
RADIATION PACKAGE MODULE FOR HEATER ELEMENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation package improving structural reliability thereof while maintaining radiation reliability thereof. <P>SOLUTION: A radiation package module for a heating element includes: a heat conducting plate 20 including a heating element 10 mounted on one surface thereof and having a groove of an internal thread shape; a heat pipe 30 screw-engaged with the groove and having a screw engagement part of an external thread shape; an adhesive applied between the groove and the screw engagement part; and a cooling unit 40 coupled to one end side of the heat pipe 30. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011044680(A) |
申请公布日期 |
2011.03.03 |
申请号 |
JP20090234547 |
申请日期 |
2009.10.08 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
KIM JONG MAN;CHOI SEOG MOON;SHIN SANG HYUN;KIM JIN SU |
分类号 |
H01L23/427;H05K7/20 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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