发明名称 RADIATION PACKAGE MODULE FOR HEATER ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a radiation package improving structural reliability thereof while maintaining radiation reliability thereof. <P>SOLUTION: A radiation package module for a heating element includes: a heat conducting plate 20 including a heating element 10 mounted on one surface thereof and having a groove of an internal thread shape; a heat pipe 30 screw-engaged with the groove and having a screw engagement part of an external thread shape; an adhesive applied between the groove and the screw engagement part; and a cooling unit 40 coupled to one end side of the heat pipe 30. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011044680(A) 申请公布日期 2011.03.03
申请号 JP20090234547 申请日期 2009.10.08
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM JONG MAN;CHOI SEOG MOON;SHIN SANG HYUN;KIM JIN SU
分类号 H01L23/427;H05K7/20 主分类号 H01L23/427
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