发明名称 |
METHOD OF MANUFACTURING PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board improved in reliability. SOLUTION: The method of manufacturing the printed wiring board 10 includes the processes of: forming a core including carbon fiber-reinforced plastic having a first through hole; forming a first film on a lower surface of the core to cover the first through hole and filling the first through hole with a first insulating member; removing the first film; forming a second through hole in the core; forming a second film on an upper surface of the core to cover the second through hole and filling the second through hole with a second insulating member; removing the second film; and forming a circuit at least on one of the first and second insulating members. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011044646(A) |
申请公布日期 |
2011.03.03 |
申请号 |
JP20090193189 |
申请日期 |
2009.08.24 |
申请人 |
MITSUBISHI ELECTRIC CORP;NIPPON AVIONICS CO LTD |
发明人 |
SAMEJIMA SOHEI;OZAKI TAKESHI;OSUGA HIROYUKI;SAKURADA KAZUHITO;HIUGA TATSUYA |
分类号 |
H05K3/44 |
主分类号 |
H05K3/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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