发明名称 METHOD OF MANUFACTURING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board improved in reliability. SOLUTION: The method of manufacturing the printed wiring board 10 includes the processes of: forming a core including carbon fiber-reinforced plastic having a first through hole; forming a first film on a lower surface of the core to cover the first through hole and filling the first through hole with a first insulating member; removing the first film; forming a second through hole in the core; forming a second film on an upper surface of the core to cover the second through hole and filling the second through hole with a second insulating member; removing the second film; and forming a circuit at least on one of the first and second insulating members. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011044646(A) 申请公布日期 2011.03.03
申请号 JP20090193189 申请日期 2009.08.24
申请人 MITSUBISHI ELECTRIC CORP;NIPPON AVIONICS CO LTD 发明人 SAMEJIMA SOHEI;OZAKI TAKESHI;OSUGA HIROYUKI;SAKURADA KAZUHITO;HIUGA TATSUYA
分类号 H05K3/44 主分类号 H05K3/44
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