SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A semiconductor package and a method for fabricating the same are provided to improve the reliability of a product by suppressing the emission of electromagnetic wave to the outside of the semiconductor package through an EMI shielding member. CONSTITUTION: In a semiconductor package and a method for fabricating the same, a semiconductor chip(110) is adhered on a substrate(100). A first EMI shielding member(130) is attached to the top edge of the substrate. A molding unit(140) molds the top of the substrate including the semiconductor chip. A second EMI shielding member(150) is arranged on the top of the molding unit. The first and second EMI shielding members include different conductive material.