| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing device for an electronic circuit board that can form a high-density electronic circuit by an ink jet method and can save the trouble and time for manufacture more than before. SOLUTION: The manufacturing device 1 for the electronic circuit board includes a laser 3 configured to form a predetermined hydrophilic pattern on a water-repellent surface of a substrate B having the water-repellent surface by irradiating the substrate B with light or an electron beam, and an ink head 2 having a print head 21 for discharging ink containing a conductive component onto the pattern. COPYRIGHT: (C)2011,JPO&INPIT
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