发明名称 |
Package, in particular for MEMS devices and method of making same |
摘要 |
A package includes a substrate provided with a passing opening and a MEMS device. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated sensitive to the chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the passing opening. A protective package incorporates the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device exposed through the passing opening of the substrate.
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申请公布号 |
US7898043(B2) |
申请公布日期 |
2011.03.01 |
申请号 |
US20080006709 |
申请日期 |
2008.01.04 |
申请人 |
STMICROELECTRONICS, S.R.L. |
发明人 |
ZIGLIOLI FEDERICO GIOVANNI;FONTANA FULVIO VITTORIO;SHAW MARK |
分类号 |
H01L27/14 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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