| 摘要 |
A floating-gate memory cell has a tunnel dielectric layer that overlies a silicon-containing semiconductor substrate and that is adjacent a trench formed in the semiconductor substrate. A floating-gate layer, having at least one silicon-containing layer, overlies the tunnel dielectric layer. An intergate dielectric layer overlies the floating-gate layer, and a control gate layer overlies the intergate dielectric layer. A first silicon oxide layer is formed on an edge of the at least one silicon-containing layer of the floating-gate layer and extends across a first portion of an edge of the tunnel dielectric layer. A second silicon oxide layer is formed on a sidewall of the trench and extends across a second portion of the edge of the tunnel dielectric layer.
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