发明名称 |
I/O pad structures for integrated circuit devices |
摘要 |
A semiconductor device, including methods and arrangements for making the same, are described. The device includes an integrated circuit die having a plurality of bond pads. At least one bond pad on the active surface of the die is an extended I/O pad. Each extended I/O pad extends to at least one peripheral side edge of the die.
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申请公布号 |
US7898088(B2) |
申请公布日期 |
2011.03.01 |
申请号 |
US20070869709 |
申请日期 |
2007.10.09 |
申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
LI FELIX C. |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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