METHOD FOR MANUFACTURING OF WAFER LEVEL DEVICE PACKAGE

摘要

PURPOSE: A method for manufacturing of a wafer level device package is provided to reduce process time and costs by replacing a complex photolithography process with a simple electroless plating process. CONSTITUTION: A conductive pad(110) is formed in at least one region of a substrate(100). A first insulation layer(120) having an opening part exposing a conductive pad to outside is formed on the substrate. A wring layer(130) contacting the conductive pad is formed in the first insulating layer. A conductive diffusion barrier(135) sealing the wiring layer is formed on the wiring layer A second insulating layer(140) having a contact hole exposing a part of the conductive diffusion barrier is formed on the conductive diffusion barrier. A bump pad is formed on a contact hole.