| 摘要 |
A clamping assembly for relieving warpage of a substrate by clamping the substrate on a base plate is provided. A gripper loading the substrate onto the base plate is fitted with clamping releasing means operable to align with and release clamping means on the base plate. A system incorporating a plurality of said clamping assembly is also provided to improve sawing of an encapsulated substrate. Fig 3a-b
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