发明名称 White Light emitting device package
摘要 PURPOSE: A white LED package is provided to implement white light with high quality by arranging an LED chip adjacently. CONSTITUTION: A package body includes a cavity which is provided on a mounting region. A sub mount substrate(120) is mounted on the bottom of the cavity. A first LED chip is arranged on the sub mount substrate. A second LED chip is separated from the LED chip on the sub mount substrate with a first distance. A plurality of phosphor layers(141,142,143) is formed on the first and second LED chips and changes the wavelength of light emitted from the first and second LED chips.
申请公布号 KR101018183(B1) 申请公布日期 2011.02.28
申请号 KR20080101230 申请日期 2008.10.15
申请人 发明人
分类号 H01L33/48 主分类号 H01L33/48
代理机构 代理人
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