DIE PACKAGE AND FABRICATING METHOD OF THE SAME

摘要

PURPOSE: A die package and a manufacturing method thereof are provided to reduce attachment lead time by attaching a die using a self-alignment. CONSTITUTION: An alignment sub insulation layer(104) is formed on one side of a support plate. A die is mounted through a solder layer formed on the lower side of the die attachment area of the support plate. A metal post is formed on the pad unit of the upper side of the die. An encapsulation layer(128) covers the die and the metal post. A rewiring layer is connected to the metal post and is extended on the encapsulation layer. A solder resist layer has an open unit which exposes the other end of the rewiring layer.