| 摘要 |
A method for the production of material plates made of chip- or fiber material, in particular of chipboard, LDF board, MDF board, HDF board, and OSB board, encompasses the steps: Provision (S2) of dried chip- or fiber material, Plasma treatment (S3a, S3b) of the dried chip- or fiber material, Application of glue (S4a, S4b) to the plasma treated chip- or fiber material, and Compression (S5) of the chip- or fiber material that has glue applied into material plates. The invention also relates to such a material plate. |
