| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer circuit board of an all-layer IVH structure that is principally composed of a material similar to that of a mother board and has a cavity. <P>SOLUTION: An upper substrate having an opening part and also having a circuit formed on a surface layer, an inter-substrate connection sheet having an opening part and also having a conduction hole formed by filling a through hole with conductive paste, and a lower substrate having a circuit formed on a surface layer are laminated, and heated and pressed. Especially, the formation end of solder resist formed at the lower substrate at a cavity bottom part is formed while providing a gap by a non-formation part with the end of the opening part of the upper substrate or the end of the opening part of the inter-substrate connection sheet to manufacture the multilayer circuit board of the all-layer IVH structure which has a cavity structure and high inter-layer connection reliability. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
